2138cn太阳集团(古天乐代言)-The Best website

谭远鑫 讲师

院部/部门:2138cn太阳集团古天乐

电子邮箱: 619189@sdnu.edu.cn     办公地点: 山东师范大学长清湖校区
个人简历

谭远鑫,男,1990年8月出生,山东泰安人,2010年6月本科毕业于山东师范大学2138cn太阳集团古天乐;2014年9月到2020年1月在中国科学院上海光学精密机械研究所硕博连读。主要从事飞秒激光微纳加工、光束整形等方面的研究。

招生方向

光学

研究方向

飞秒激光微纳加工,光场调控

论文成果

[1]Yuanxin Tan, Zhaohui Wang, Wei Chu, Yang Liao, Lingling Qiao and Ya Cheng*. High-throughput in-volume processing in glass with isotropic spatial resolutions in three dimensions, Optics Materials Express, 2016, 6(12), 3787-3793.

[2]Yuanxin Tan, Wei Chu, Jintian Lin, Zhiwei Fang, Yang Liao and Ya Cheng*, Metal surface structuring with spatiotemporally focused femtosecond laser pulses. Journal of Optics, 2017, 20(1), 014010.

[3]Yuanxin Tan, Wei Chu, Peng Wang, Wenbo Li, Jia Qi, Jian Xu, Zhanshan Wang and Cheng Ya*. High-throughput multi-resolution three dimensional laser printing, Physica Scripta 2018, 94(1), 015501.

[4]Yuanxin Tan, Wei Chu, Peng Wang, Wenbo Li, Zhe Wang and Ya Cheng*. Water-assisted laser drilling of high-aspect-ratio 3D microchannels in glass with spatiotemporally focused femtosecond laser pulses, Optics Materials Express 2019, 9(4), 1971-1978.

[5]Wei Chu, Yuanxin Tan, Peng Wang, Jian Xu, Li Wenbo, Jia Qi and Ya Cheng*, Centimeter‐Height 3D printing with femtosecond laser two‐photon polymerization. Advanced Materials Technologies 2018, 3(5), 1700396.

[6]Fei He, Junjie Yu, Yuanxin Tan, Wei Chu, Changhe Zhou, Ya Cheng*and Koji Sugioka*, Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias. Scientific reports 2017, 7, 40785.

[7]Peng Wang, Wei Chu, Wenbo Li, Yuanxin Tan, Jia Qi, Yang Liao, Zhanshan Wang and Ya Cheng*, Aberration-insensitive three-dimensional micromachining in glass with spatiotemporally shaped femtosecond laser pulses. Optics letters 2018, 43(15), 3485-3488.

[8]Peng Wang, Wei Chu, Wenbo Li, Yuanxin Tan, Fang Liu, Min Wang, Jia Qi, Jintian Lin, Fangbo Zhang, Zhanshan Wang and Ya Cheng*. Three-dimensional laser printing of macro-scale glass objects at a micro-scale resolution. Micromachines 2019, 10, 565.

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